Light emitting diode package substrate



FIG. 1 is a perspective view of a first embodiment of a light emitting diode package substrate showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view thereof with a light emitting diode chip mounted;

FIG. 9 is a perspective view of a second embodiment thereof;

FIG. 10 is a front view thereof;

FIG. 11 is a rear view thereof;

FIG. 12 is a left side view thereof;

FIG. 13 is a right side view thereof;

FIG. 14 is top view thereof;

FIG. 15 is a bottom view thereof;

FIG. 16 is a perspective view thereof with light emitting diode chips mounted;

FIG. 17 is a perspective view of a third embodiment thereof;

FIG. 18 is a front view thereof;

FIG. 19 is a rear view thereof;

FIG. 20 is a left side view thereof;

FIG. 21 is a right side view thereof;

FIG. 22 is top view thereof;

FIG. 23 is a bottom view thereof;

FIG. 24 is a perspective view thereof with light emitting diode chips mounted;

FIG. 25 is a perspective view of a fourth embodiment thereof;

FIG. 26 is a front view thereof;

FIG. 27 is a rear view thereof;

FIG. 28 is a left side view thereof;

FIG. 29 is a right side view thereof;

FIG. 30 is top view thereof;

FIG. 31 is a bottom view thereof; and,

FIG. 32 is a perspective view thereof with light emitting diode chips mounted.

The broken lines are for the purpose of illustrating portions of the light emitting diode package substrate and the light emitting diode chips and form no part of the claimed design. The light shade lines on the surface portions indicate contour and not surface decoration. 

CLAIM The ornamental design for a light emitting diode package substrate, as shown and described. 